发明名称 IMPROVED METHOD FOR FORMING METAL CONTACT
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for forming metal contact using metal ink in manufacturing a photovoltaic device. <P>SOLUTION: Metal ink is selectively deposited on a semiconductor coating selectively using ink jet and an aerosol device. The composite body is heated to a selective temperature to form an electric contact with a semiconductor by making the metal ink burn through the coating. Then a metal layer is deposited on the electric contact with light induction or light assist plating. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012094859(A) 申请公布日期 2012.05.17
申请号 JP20110225620 申请日期 2011.10.13
申请人 ROHM & HAAS ELECTRONIC MATERIALS LLC;NATIONAL RENEWABLE ENERGY LABORATORY 发明人 REDDINGTON ERIK;THOMAS C SATHER;BU LUJIA;PERRAS ALEXANDRA;HABAS SUSAN E;CURTIS CALVIN J;MIEDANER ALEXANDER;DAVID S GINLEY;MARINUS FRANCISCUS ANTONIUS MARIA VAN HEST
分类号 H01L31/04;H01L21/28;H01L21/288 主分类号 H01L31/04
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