发明名称 |
HIGH MOLECULAR WEIGHT EPOXY RESIN, RESIN FILM USING THE HIGH MOLECULAR WEIGHT EPOXY RESIN, RESIN COMPOSITION, AND CURED PRODUCT |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin capable of satisfying low linear expansion, self-film formability, and handling property. <P>SOLUTION: There is provided a high molecular weight epoxy resin (C) having a weight-average molecular weight of 30,000 to 80,000 converted into standard polystyrene by gel permeation chromatography (hereinafter GPC) and obtained by reacting a bi-functional epoxy resin (A) containing an epoxy resin (a) represented by general formula (1) (n is a repeating unit, and n is an integer of ≥0) in an amount of ≥50 wt.% with a compound (B) having two phenolic hydroxyl groups in one molecule in a solvent. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012092158(A) |
申请公布日期 |
2012.05.17 |
申请号 |
JP20100237992 |
申请日期 |
2010.10.22 |
申请人 |
NIPPON STEEL CHEM CO LTD |
发明人 |
NAKANISHI TETSUYA;ASAKAGE HIDEYASU;UCHIDA MIYUKI |
分类号 |
C08G59/14;B32B27/00;B32B27/38;C08J5/24;C09J7/02;C09J163/00 |
主分类号 |
C08G59/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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