发明名称 HIGH MOLECULAR WEIGHT EPOXY RESIN, RESIN FILM USING THE HIGH MOLECULAR WEIGHT EPOXY RESIN, RESIN COMPOSITION, AND CURED PRODUCT
摘要 <P>PROBLEM TO BE SOLVED: To provide an epoxy resin capable of satisfying low linear expansion, self-film formability, and handling property. <P>SOLUTION: There is provided a high molecular weight epoxy resin (C) having a weight-average molecular weight of 30,000 to 80,000 converted into standard polystyrene by gel permeation chromatography (hereinafter GPC) and obtained by reacting a bi-functional epoxy resin (A) containing an epoxy resin (a) represented by general formula (1) (n is a repeating unit, and n is an integer of &ge;0) in an amount of &ge;50 wt.% with a compound (B) having two phenolic hydroxyl groups in one molecule in a solvent. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012092158(A) 申请公布日期 2012.05.17
申请号 JP20100237992 申请日期 2010.10.22
申请人 NIPPON STEEL CHEM CO LTD 发明人 NAKANISHI TETSUYA;ASAKAGE HIDEYASU;UCHIDA MIYUKI
分类号 C08G59/14;B32B27/00;B32B27/38;C08J5/24;C09J7/02;C09J163/00 主分类号 C08G59/14
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