| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a planarization processing method for a hard brittle wafer, enabling reduction in processing distortion of and micro scratches on the hard brittle wafer, shortening of total planarization processing time and increase in the number of wafers obtained from an ingot, and a pad for planarization processing. <P>SOLUTION: A pad for planarization processing made of fiber with high strength and high elasticity is pressed against at least a surface out of the surface and a back face of a sliced hard brittle wafer, and the hard brittle wafer is roughly planarized while processing liquid including loose grains is supplied. Then, final polishing of the surface of the wafer is performed. As a result, processing distortion of the wafer is reduced, and thus, the number of generated micro scratches can be reduced. Total planarization processing time can be shortened, and also the number of wafers obtained from one ingot can be increased. <P>COPYRIGHT: (C)2012,JPO&INPIT |
