发明名称 |
METHOD FOR PRODUCING AN INTEGRATED CIRCUIT AND RESULTING FOIL CHIP |
摘要 |
A semiconductor substrate having a first lateral dimension is combined with a flexible film piece having a second lateral dimension by arranging the semiconductor substrate in a recess of the film piece. The semiconductor substrate has circuit structures produced using lithography process steps. After the semiconductor substrate has been arranged in the recess of the film piece, a patterned layer of an electrically conductive material is produced above the semiconductor substrate and the film piece using lithography process steps. The patterned layer extends from the semiconductor substrate up to the flexible film piece and forms a number of electrically conductive contact tracks between the semiconductor substrate and the film piece. |
申请公布号 |
EP2452359(A1) |
申请公布日期 |
2012.05.16 |
申请号 |
EP20100728257 |
申请日期 |
2010.07.06 |
申请人 |
INSTITUT FUER MIKROELEKTRONIK STUTTGART |
发明人 |
BURGHARTZ, JOACHIM;HARENDT, CHRISTINE |
分类号 |
H01L23/498;H01L21/68;H01L23/538 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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