发明名称 |
METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD |
摘要 |
<p>The present invention relates to a circuit board comprising:
a circuit groove having at least one land region for surface mounting of electronic parts and at least one circuit wiring region formed integrally with the land region, and
a partial reinforcing structure formed in the land region of the circuit groove,
wherein the partial reinforcing structure is at least one structure selected from a group consisting of:
an irregular shape having a ten-point average roughness (Rz) of 0.1 to 20 µm formed on the groove surface in the land region,
a groove shape having the groove depth in the land region larger than that of the circuit wiring region to form a plated film having thickness in the land region thicker than that of the circuit wiring region, and
a structure formed by forming at least one protrusion on the periphery of the groove in the land region.</p> |
申请公布号 |
EP2255601(B1) |
申请公布日期 |
2012.05.16 |
申请号 |
EP20090738906 |
申请日期 |
2009.04.30 |
申请人 |
PANASONIC CORPORATION |
发明人 |
YOSHIOKA, SHINGO;FUJIWARA, HIROAKI |
分类号 |
H05K3/10;H05K1/02;H05K1/16;H05K3/18;H05K3/46 |
主分类号 |
H05K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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