发明名称 |
System and method for photolithography in semiconductor manufacturing |
摘要 |
A method for producing a pattern on a substrate includes providing at least one exposure of the pattern onto a layer of the substrate by a higher-precision lithography mechanism and providing at least one exposure of the pattern onto a layer of the substrate by a lower-precision lithography mechanism. The exposures can be done in either order, and additional exposures can be included. The higher-precision lithography mechanism can be immersion lithography and the lower-precision lithography mechanism can be dry lithography. |
申请公布号 |
US8178289(B2) |
申请公布日期 |
2012.05.15 |
申请号 |
US20090362316 |
申请日期 |
2009.01.29 |
申请人 |
CHEN KUEI SHUN;LIN CHIN-HSIANG;LU DAVID DING-CHUNG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHEN KUEI SHUN;LIN CHIN-HSIANG;LU DAVID DING-CHUNG |
分类号 |
G03F7/20;G03F7/26 |
主分类号 |
G03F7/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|