| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor measuring device in which even a thin wafer to be tested can be supported with no deflection, and a probe needle can be brought into contact with the back electrode of a wafer to be tested reliably and easily with a simple structure. <P>SOLUTION: The semiconductor measuring device comprises a wafer chuck with a support surface for supporting a wafer to be tested, at least three chuck pins penetrating the wafer chuck in the vertical direction, a first moving mechanism which moves the chuck pin in the vertical direction, at least one lower probe needle inserted in the inside of the chuck pin, a second moving mechanism which moves the lower probe needle in the vertical direction, a third moving mechanism which moves the wafer chuck in the vertical direction and the horizontal direction, and a tester connected electrically with an upper prove needle and the lower probe needle. <P>COPYRIGHT: (C)2012,JPO&INPIT |
