| 摘要 |
A heat dissipation structure mounted onto an electronic element to dissipate heat. The heat dissipation structure includes a heat absorber connected with the electronic element and a heat sink. The heat absorber has a hollow first chamber to hold a working fluid. The heat absorber and heat sink are interposed by a plurality of first conduits. When the heat absorber absorbs heat generated by the electronic element through a contact surface, the working fluid held therein is vaporized into vapor. The vapor enters a second chamber of the heat sink through the first conduits and performs heat exchange with a cooling surface of the heat sink to be converted into the working fluid again. The working fluid is conveyed via a capillary structure in the second conduit to the first chamber to form a thermal cycle. The structure of the invention is simpler and can rapidly absorb and dissipate heat. |
