| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and device for thermocompression bonding, which can prevent any warping and can shorten a treatment time, and a thermocompression bonding device. <P>SOLUTION: Thermocompression bonding is performed via a step of pre-heating a resin member by using infrared-ray irradiation, and a step of thermocompression-bonding the resin member by using a heating and pressing unit. The thermocompression bonding device includes a pre-heating part having an infrared-ray irradiator, a thermocompression bonding part having the heating and pressing unit, and a transportation unit for transporting the resin member to the thermocompression bonding part from the pre-heating part while keeping a pre-heated state. <P>COPYRIGHT: (C)2012,JPO&INPIT |
