| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor laser which can be easily made into a thin package by wireless connection. <P>SOLUTION: The semiconductor laser comprises a first conductive type cladding layer 14, an active layer 16, a second conductive type cladding layer 18 and a surface electrode layer 20 sequentially arranged on a substrate 10; a rear face electrode layer 22 arranged on a rear face of the substrate 10; a first insulator layer 24a formed along a first cleavage surface 42a of the substrate 10, the first conductive type cladding layer 14, the active layer 16 and the second conductive type cladding layer 18, and extending on the surfaces of the first cleavage surface 42a and the surface electrode layer 20 and on the surface of the rear face electrode layer 22; a second insulator layer 24b formed along a second cleavage surface 42b opposed to the first cleavage surface 42a and extending on the surfaces of the second cleavage surface 42b and the surface electrode layer 20 and on the surface of the rear face electrode layer 22; and a first electrode layer 26A arranged on one part on the first insulator layer 24a and on the surface electrode layer 20. <P>COPYRIGHT: (C)2012,JPO&INPIT |
