MOUNTING SUBSTRATE FOR SEMICONDUCTOR LIGHT EMITTING ELEMENT, BACKLIGHT CHASSIS, DISPLAY DEVICE AND TELEVISION RECEIVER

摘要

Disclosed are a mounting substrate for semiconductor light emitting elements, a backlight chassis containing the substrate, a display device and a television receiver. The substrate is easily manufactured and has a simple structure that allows good dissipation of heat from semiconductor light emitting elements, and can suppress temperature increases when mounted thereupon with a flip flop-type semiconductor light emitting element. A mounting substrate for semiconductor light emitting elements comprises a pair of electrode patterns that respectively connect the positive and negative electrodes of LED chips on an insulating substrate and wire patterns drawn between the electrode patterns. The pair of the electrode patterns have a larger surface area than the wire patterns. This allows heat from the LED chips to transfer favorably via the large electrode patterns to the insulating substrate. The mounting substrate is attached to a backlight chassis.