| 摘要 |
An adhesive sheet for processing of a semiconductor wafer has an adhesive layer disposed on at least one surface of a base substrate, the adhesive layer includes a base polymer, a plasticizer and a surfactant, an SP value of the plasticizer and the surfactant satisfies the relationship: 0.9≦̸(the plasticizer SP value)/(the surfactant SP value)≦̸1.0. The present invention has the object of providing an adhesive sheet for processing of a semiconductor wafer that exhibits superior storage stability under a range of environments, and that prevents contamination of the adherend after use.
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