MINIATURE SURFACE MOUNT DEVICE WITH LARGE PIN PADS
摘要
<p>One embodiment of the surface mount light emitting diode (LED) package (10) includes a lead frame and a plastic casing (12) at least partially encasing the lead frame. The lead frame includes a plurality of electrically conductive chip carriers. There is an LED (44, 46, 48) disposed on each one of the plurality of electrically conductive chip carriers. A profile height of the surface mount LED package (10) is less than about 1.0 mm.</p>
申请公布号
WO2012058852(A1)
申请公布日期
2012.05.10
申请号
WO2011CN00335
申请日期
2011.03.02
申请人
CREE HUIZHOU SOLID STATE LIGHTING COMPANY LIMITED;CHAN, CHI KEUNG;PANG, CHAK HAU;LI, FEIHONG;LAU, YUE KWONG VICTOR;ZHANG, JUN;EMERSON, DAVID TODD
发明人
CHAN, CHI KEUNG;PANG, CHAK HAU;LI, FEIHONG;LAU, YUE KWONG VICTOR;ZHANG, JUN;EMERSON, DAVID TODD
