摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition that is excellent in storage stability and has low linear expansion coefficient after being cured. <P>SOLUTION: The epoxy resin composition contains: an epoxy resin; and microcapsules each have a curing agent or a curing accelerator included thereinside by a shell. The shell is formed of a copolymer that generates a polyimide backbone by heating. <P>COPYRIGHT: (C)2012,JPO&INPIT |