发明名称 EPOXY RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition that is excellent in storage stability and has low linear expansion coefficient after being cured. <P>SOLUTION: The epoxy resin composition contains: an epoxy resin; and microcapsules each have a curing agent or a curing accelerator included thereinside by a shell. The shell is formed of a copolymer that generates a polyimide backbone by heating. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012087229(A) 申请公布日期 2012.05.10
申请号 JP20100235789 申请日期 2010.10.20
申请人 SEKISUI CHEM CO LTD 发明人 IWAMOTO MASASHI;YAMADA YASUYUKI;KIN CHIZURU;YAMAUCHI HIROSHI;MORITA HIROYUKI
分类号 C08G59/40;C08F2/44 主分类号 C08G59/40
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