发明名称 THERMAL CONDUCTIVE PAD
摘要 <p>A thermal conductive pad includes a top surface(1), a bottom surface(2) and a elastic part(3) made of metal; the top surface(1) connected with the bottom surface(2) by a bending part(4), the top surface(1) and the bottom surface(2) are paralleled with each other; the spring part(3) located between the top surface(1) and the bottom surface(2) and elastically contacted with them respectively.</p>
申请公布号 WO2012058926(A1) 申请公布日期 2012.05.10
申请号 WO2011CN75403 申请日期 2011.06.07
申请人 IMFOCUS TECHNOLOGIES CO., LTD;PENG, YAOFENG;SHI, JIAN;HU, WEIFENG;YANG, BO 发明人 PENG, YAOFENG;SHI, JIAN;HU, WEIFENG;YANG, BO
分类号 H01L23/36;H05K7/20 主分类号 H01L23/36
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