发明名称 SENSOR MODULE, SENSOR DEVICE, METHOD FOR MANUFACTURING SENSOR MODULE, AND ELECTRONIC APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a sensor module corresponding to multiple axes, and to provide a sensor device including the sensor module. <P>SOLUTION: A sensor module 1 includes: a support member 10 having three support faces 11, 12, 13 intersecting with each other at right angles; IC chips 20 each of which has connection terminals 22 on an active face 21 side and has a non-active face 29 side along the active face 21 attached to each of the support faces 11, 12, 13 of the support member 10; vibration gyro elements 30 each having a base part 31, a vibration arm extended from the base part 31 and a connection electrode 39; and relay substrates 50 each of which is arranged between the IC chip 20 and the vibration gyro element 30 and has one face 50a attached to the IC chip 20. Each vibration gyro element 30 is arranged on the other face 50b side along the one face 50a of the relay substrate 50, the connection electrode 39 is attached to the relay substrate 50 so that one principal surface 30a is placed along each of the support faces 11, 12, 13, and the connection electrode 39 is connected to the connection terminal 22 of the IC chip 20 through the relay substrate 50. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012088137(A) 申请公布日期 2012.05.10
申请号 JP20100234249 申请日期 2010.10.19
申请人 SEIKO EPSON CORP 发明人 KOYAMA YUGO
分类号 G01C19/56;G01C19/5621;G01C19/5628;G01P15/08;H01L41/08;H01L41/09;H01L41/18;H01L41/187;H01L41/22;H01L41/23;H01L41/311;H01L41/313 主分类号 G01C19/56
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