| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead frame connector for connecting an optical subassembly to a printed circuit board in an optical transceiver module. <P>SOLUTION: The lead frame connector includes a conductive lead structure that is encased in a plurality of polymer casings. The polymer casings provide electrical insulation for conductors in a lead frame as well as mechanical support for a finished component. One or more passive components can be mounted to the conductors of the lead frame connector to aid with impedance matching between the optical subassembly, the lead frame connector and the printed circuit board. The lead frame connector connects to leads associated with the optical subassembly and is surface-mounted onto the printed circuit board to establish connectivity between the optical subassembly and the printed circuit board. <P>COPYRIGHT: (C)2012,JPO&INPIT |
