| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and a device for peeling a protective tape from the wafer surface with high precision. <P>SOLUTION: An annular protrusion formed to be left on the rear surface of a wafer W to surround a back grind region is suction held by a first holding table 6a, and a second holding table 6b having an outer peripheral wall in close proximity to the inner wall of the annular protrusion is inserted into a flat recess on the inside of the annular protrusion. While suction holding the flat surface, an adhesive tape T for peeling is stuck to a protective tape on the surface of the wafer W, and then the protective tape is peeled off integrally from the surface of the wafer W by peeling the adhesive tape T. <P>COPYRIGHT: (C)2012,JPO&INPIT |
