| 摘要 |
A method of manufacturing a semiconductor device which is excellent in high-temperature high-humidity reliability without decreasing moldability and curability is provided. The method includes sealing a semiconductor element in resin using a semiconductor-sealing epoxy resin composition; and then performing a heating treatment. The semiconductor-sealing epoxy resin composition contains (A) an epoxy resin of formula (1): wherein X is a single bond,—CH2—,—S—or—O—; and R1 to R4, which may be the same as or different, are each—H or—CH3, (B) a phenolic resin, (C) an amine-based curing accelerator, and (D) an inorganic filler. The heating treatment is performed under heat treatment conditions defined by a region in which a relationship t≧3.3�10−5 exp(2871/T) is satisfied where t is heat treatment time in minutes and T is heat treatment temperature in � C. and where 185≰T≰300. |
