| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead terminal capable of preventing concentration of stress, and to provide an insulating substrate with a lead terminal and a package for housing an element. <P>SOLUTION: The lead terminal 2 has a lead pad part 2a provided at one end, a lead part 2b provided at the other end and narrower than the lead pad 2a, and a taper part 2c provided between the lead pad part 2a and the lead part 2b and becomes narrower gradually from the lead pad part 2a toward the lead part 2b. At least the lead pad part 2a is bonded to a conductive pad 1a provided on an insulating substrate 1 via a bonding material. <P>COPYRIGHT: (C)2012,JPO&INPIT |
