| 摘要 |
<P>PROBLEM TO BE SOLVED: To curb, in a semiconductor sensor of this invention, an entire area of a sensor substrate as much as possible while positioning a plurality of sensor substrates with accuracy. <P>SOLUTION: A semiconductor sensor is provided with: a first sensor substrate having a groove or protrusion formed on a sensor surface thereof; a second sensor substrate having a groove or protrusion formed on a sensor surface thereof; and a cap substrate having, on one side thereof, a first protrusion or groove capable of engaging with the groove or protrusion of the first sensor substrate, and on the other side thereof, a second protrusion or groove capable of engaging with the groove or protrusion of the second sensor substrate. The first sensor substrate is bonded to one surface of the cap substrate with the groove or protrusion thereof engaging with the first protrusion or groove, and the second sensor substrate is bonded to the other surface side of the cap substrate with the groove or protrusion thereof engaging with the second protrusion or groove. <P>COPYRIGHT: (C)2012,JPO&INPIT |
