POLYAMIDE RESIN COMPOSITION, EXPANDED POLYAMIDE RESIN MOLDING, AND AUTOMOTIVE RESIN MOLDING

摘要

Provided is a polyamide resin composition which can provide an expanded molding having excellent heat resistance, a satisfactorily light weight and high load resistance by a simple molding process. The polyamide resin composition is characterized by comprising a polyamide resin (A), a glycidyl-group-containing styrene copolymer (B) having at least two glycidyl groups per molecule, a weight average molecular weight of 4000-25000 and an epoxy value of 400-2500 equivalents/1×106 g and an inorganic reinforcing material (C) at such a ratio that the content of the glycidyl-group-containing styrene copolymer (B) is 0.2-25 parts by mass and the content of the inorganic reinforcing material (C) is 0-350 parts by mass relative to 100 parts by mass of the polyamide resin (A).