| 摘要 |
A quad flat package (QFP) includes a semiconductor chip (120), a paddle (110) to support the semiconductor chip (120), a molding portion (140) to surround the semiconductor chip (120), a plurality of leads (150) formed on four sides of the molding portion (140), and a plurality of bonding wires (160) to electrically connect the plurality of leads (150) to the semiconductor chip (120), wherein the paddle (110) is exposed to outside from at least one corner of a lower surface of the molding portion (140). |
