发明名称 LIGHT EMITTING DEVICE PACKAGE
摘要 PURPOSE: A light emitting device package is provided to improve durability by forming a heat resistant part on the light emitting device package. CONSTITUTION: A body(110) comprises a cavity and a wall. The first lead frame and the second lead frame are mounted on the body. A light source part(130) is electrically connected to the first and second lead frames. A heat resistant part(160) is mounted on the body. The heat resistant part includes an exposure part which forms one or more regions inside of the cavity.
申请公布号 KR20120045540(A) 申请公布日期 2012.05.09
申请号 KR20100107147 申请日期 2010.10.29
申请人 LG INNOTEK CO., LTD. 发明人 KANG, KYOUNG MO
分类号 H01L33/64 主分类号 H01L33/64
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