| 摘要 |
PURPOSE: A lower die block and a mold unit for molding an electronic part therewith are provided to simplify the molding process of an electronic part by adjusting the height of a lower mold using a gap adjusting member. CONSTITUTION: A lower die block(100) comprises a lower press(110), a lower mold(120), and a gap adjusting member(130). The lower mold is arranged on the lower press and supports electronic parts(10). The gap adjusting member is slid between the lower press and the lower mold. The gap adjusting member adjusts the height of the lower mold by adjusting a gap between the lower press and the lower mold.
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