THREE DIMENSIONAL STACKED SEMICONDUCTOR INTEGRATED CIRCUIT AND TSV REPAIR METHOD OF THE SAME

摘要

PURPOSE: A 3D laminate semiconductor integrated circuit and a TSV(Through Silicon Via) repair method thereof are provided to reduce test time by automatically testing a plurality of TSVs. CONSTITUTION: A plurality of chips(CHIP0-CHIP3) comprise a master and a slave. A test block(200) detects a TSV with a defect by receiving a current through a plurality of TSVs and generates a repair signal according to the detection result. An encoder(300) generates an encoding signal by encoding the repair signal. A transmitting/receiving unit transmits the encoding signal to the remaining chips after the defective TSV is replaced with a normal TSV according to a repair signal.