| 摘要 |
PURPOSE: A light emitting device, a manufacturing method thereof, a light emitting device package, and a lighting system are provided to improve light extraction efficiency of the light emitting device by minimizing an amount of reflected light. CONSTITUTION: A light emitting structure layer(135) comprises a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer. A first electrode is connected to the first conductivity type semiconductor layer. A first conductive layer is formed under the second conductivity type semiconductor layer. A second conductive layer(160) is formed under the first conductive layer. An insulating support member(190) is formed under a third conductive layer. A second electrode is electrically connected to the second conductivity type semiconductor layer on the third conductive layer. |
