| 摘要 |
PURPOSE: A copper alloy, a processed copper article, an electronic part, and a connector are provided to obtain good balance between strength and bendability through proper development of a modulated structure by spinodal decomposition. CONSTITUTION: A copper alloy comprises Ti 2.0-4.0wt.%, a third element of 0-0.5wt.%, and copper and inevitable impurities of the remaining amount. The third element comprises one or more of Mn(Manganese), Fe(Iron), Mg(Magnesium), Co(Cobalt), Ni(Nickel), Cr(Chromium), V(Vanadium), Nb(Niobium), Mo(Molybdenum), Zr(Zirconium), Si(Silicon), B(Boron), and P(Phosphorus). A rolled surface undergoes electrolyte polishing, and the organization of the surface is analyzed with an electron microscope. As a result of the analysis, the number density(X) of second phase particles with a grain diameter 0.5 micron meters or greater is 0.11-0.04 number/μm^2 and the number ratio(Y) of the second phase particles with a grain diameter of 0.5 micron meters or greater precipitated according to a grain boundary is with 45-80%.
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