| 摘要 |
Various embodiments of the invention include methods and systems for trimming electronic circuits using short laser pulses of near-infrared wavelength at a high repetition rate. The laser pulses ablate material from a spot on a circuit with minimal thermal and photoelectric disturbances to circuit performance. Minimal disturbance to circuit performance allows for repeated trimming and testing without pausing for circuit reinitialization. To optimize trimming, the laser pulses can also be adjusted responsive to the composition of the material ablated. In some embodiments, the system is configured to trim a plurality of circuits in parallel. |
