发明名称 |
Stacked multi-chip |
摘要 |
A stacked multi-chip comprises a base layer, a first chip, a first stacked chip and at least one second stacked chip. The base layer comprises a mounting panel and a redistributed layer. The redistributed layer is mounted on the mounting panel. The first chip comprises an electrically non-conductive layer and a connective layer. The electrically non-conductive layer comprises a TSV channel. The connective layer abuts the redistributed layer. The first stacked chip is mounted on the first chip and comprises an electrically non-conductive layer and a connective layer. The electrically non-conductive layer comprises a TSV channel that is connected to the TSV channel of the first chip. The second stacked chip is mounted on the first stacked chip and comprises an electrically non-conductive layer and a connective layer. The electrically non-conductive layer comprises a TSV channel. The connective layer is connected to the connective layer of the first stacked chip. |
申请公布号 |
US8174126(B2) |
申请公布日期 |
2012.05.08 |
申请号 |
US20100882805 |
申请日期 |
2010.09.15 |
申请人 |
HWANG TING-TING;CHEN HSIEN-TE;NATIONAL TSING HUA UNIVERSITY |
发明人 |
HWANG TING-TING;CHEN HSIEN-TE |
分类号 |
H01L23/12;H01L23/48;H01L23/52 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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