| 摘要 |
PURPOSE: A minute vertical type probe is provided to buffer stylus force due to external force by adding a stylus force alleviating part capable of executing a stylus force alleviating function and to prevent the bump electrode pad of a semiconductor chip which is tested by little stylus force to be damaged. CONSTITUTION: A contact piece(20) is composed of a bottom vertical cylinder part(25) and a bottom sacrificial part(29). The bottom vertical cylinder part and the bottom sacrificial part are inserted in a lower plate structure hole and the bottom sacrificial part is eliminated in the bottom vertical cylinder part. A bottom cutting hole(27) is formed between the bottom vertical cylinder part and the bottom sacrificial part. An elastic piece(30) is formed between upper limit protrusions(43) of a conducting piece(40) in the end part of a lower limit protrusion of the contact piece. A lower part taper part(35) is formed in the upper side of the elastic piece.
|
