发明名称 |
A LAMINATED CERAMIC ELECTRONIC PARTS AND A MANUFACTURING METHOD THEREOF |
摘要 |
<p>PURPOSE: A laminated ceramic electronic component and a manufacturing method thereof are provided to control thermal shock cracks by controlling rate of the thickness of an internal electrode and the thickness of a dielectric and controlling the thickness of the dielectric. CONSTITUTION: The average thickness of a plurality of dielectric layers(1) is less than 1μm. The rate of the thickness of an internal electrode layer(2) and the thickness of the dielectric layer is 0.8 to 1.3. Withstand voltage characteristics are improved through equalization of the thickness of the dielectric layer and mass storage conversion of the electrostatic capacity. The internal electrode layer is spread on the dielectric layer in order to obtain connectivity more than 90%. The plurality of dielectric layers in which the internal electrode layer is spread is laminated.</p> |
申请公布号 |
KR20120043501(A) |
申请公布日期 |
2012.05.04 |
申请号 |
KR20100104836 |
申请日期 |
2010.10.26 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
CHANG, DONG IK;HUR, KANG HEON;KIM, DOO YOUNG;JEONG, JI HUN |
分类号 |
H01G4/12;H01B1/22;H01G4/232;H01G4/30;H01G13/00 |
主分类号 |
H01G4/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|