METHOD AND APPARATUS FOR TESTING 3D INTEGRATED CIRCUITS

摘要

A method and apparatus for testing a scan-based 3D integrated circuit (3DIC) using time-division demultiplexing/multiplexing allowing for high-data-rate scan patterns applied at input/output pads converting into low-data-rate scan patterns applied to each embeddded module in the 3DIC. A set of 3D design guidelines is proposed to reduce the number of test times and the number of through-silicon vias (TSVs) required for both pre-bond testing and post-bond testing. The technique allows reuse of scan patterns developed for pre-bond testing of each die (layer) for post-bond testing of the whole 3DIC. It further reduces test application time without concerns for I/O pad count limit and risks for fault coverage loss.