发明名称 |
POWER MODULE USING SINTERING DIE ATTACH AND MANUFACTURING METHOD THEREOF |
摘要 |
Disclosed herein are a power module using sintering die attach and a manufacturing method of the same. The power module includes: a substrate having an insulating layer formed on a surface of a metal plate; a circuit layer formed on the substrate and including a wiring pattern and an electrode pattern; a device mounted on the wiring pattern; a sintering die attach layer applying a metal paste between the wiring pattern and the device and sintering the metal paste to bond the wiring pattern to the device; and a lead frame electrically connecting the device to the electrode pattern, whereby making it possible to to simplify and facilitate the process, increase electrical efficiency and improve radiation characteristics, and manufacture firm and reliable power module.
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申请公布号 |
US2012106109(A1) |
申请公布日期 |
2012.05.03 |
申请号 |
US201113007485 |
申请日期 |
2011.01.14 |
申请人 |
KIM TAE HYUN;JOO YONG HUI;CHOI SEOG MOON;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM TAE HYUN;JOO YONG HUI;CHOI SEOG MOON |
分类号 |
H05K7/02;B23K1/20;B23K31/02 |
主分类号 |
H05K7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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