| 摘要 |
A copper foil for a semiconductor package substrate comprising a chromate treatment layer or a coating layer made of zinc or zinc oxide and chromium oxide formed on a roughened surface of a copper foil to serve as an adherend surface with resin, and a silane coupling agent layer. With this copper foil for a semiconductor package substrate, the amount of Cr in the chromate coating layer is 25 to 150 μg/dm2, and the amount of Zn is 150 μg/dm2 or less. Moreover, with this copper foil for a semiconductor package substrate, the silane coupling agent layer contains tetraalkoxysilane, and at least one type of alkoxysilane comprising a functional group possessing reactivity with resin. Provided is an electrolytic treatment technique of a copper foil capable of effectively preventing the circuit corrosion phenomenon upon laminating a copper foil on a resin base material, and using a sulfuric acid-based etching solution to perform soft etching to a circuit. |
