COPPER-CORED SOLDER BALLS FOR MICRO-ELECTRONIC PACKAGES AND MICRO-ELECTRONIC PACKAGES INCLUDING THE SAME

摘要

PURPOSE: An unleaded solder ball of a copper core and a semiconductor package including the same are provided to improve reliability of a solder joint which is used for a bonding part of the semiconductor package. CONSTITUTION: A core comprises copper. A plating layer comprises tin and indium. The diameter of the core is a range of 10nm~10mm. The thickness of the plating layer is a range of 0.1um-900um. Copper content of the core is over 10mass%. A copper alloy core is formed by mixing copper with one among zinc, tin, lead, nickel, silver, palladium, antimony, aluminum, manganese, molybdenum, and gold.