GLASS SUBSTRATE CUTTING SYSTEM USING LASER

摘要

The present invention relates to a glass substrate cutting system using a laser. In detail, the glass substrate cutting system using a laser may correct a cutting line radiated with a laser beam on a transferred glass substrate seated on a process table in real-time to precisely process the glass substrate. Also, a process for cutting both side portions of the glass substrate, a process for rotating the glass substrate at an angle of about 90 degrees, and a process for cutting both of the other side portions of the glass substrate may be performed on a continuous line to significantly reduce a takt time. In addition, the outermost fixing rod part and conveyer part of a plurality of fixing rod parts and conveyer parts may be perpendicularly folded and expanded with respect to a length direction to compatibly cut the glass substrate seated on a top surface of the process table in size.