Composite build-up materials for embedding of active components

摘要

Disclosed are composite build-up materials for the manufacture of printed circuit boards, IC substrates, chip packages and the like. The composite build-up materials are suitable for embedding active components such as micro chips.
The composite build-up materials comprise a carrier layer (1), a resin layer with reinforcement (2), and a resin layer without reinforcement (3). The active component (6) is embedded into the resin layer without reinforcement (6).