| 摘要 |
<p>PURPOSE: A solid imaging apparatus and an electronic device are provided to control coupling capacitance between adjacent connecting connection wiring lines and/or coupling capacitance between a first wire and a second wire. CONSTITUTION: Two or more semiconductor chip parts are welded to a laminating semiconductor chip. A plurality of connection wiring lines(67) connects an interval of a first semiconductor chip part and a second semiconductor chip part. A pixel array and a first multi-wiring layer are formed on the first semiconductor chip part. A logic circuit and a second multi-wiring layer are formed on the second semiconductor chip part. A shielding wiring line(113) is formed into a pattern of a comb-shaped liberating the extension side of a routing wiring line. A connecting conductor is connected to a first connecting pad which is extended from a first wiring line.</p> |
