THE APPARATUS TO PASSIVATE SUPERCONDUCTING METAL CIRCUIT ON A MEMS DEVICE IN WET CHEMICAL ETCHING AND THE WET CHEMICAL ETCHING USING THE APPARATUS

摘要

PURPOSE: A cross section wet etching apparatus and method for protecting a superconducting metal circuit surface during the manufacture of a MEMS device using wet etching are provided to prevent damage to a superconductive metal of a MEMS substrate when depositing SiN on the MEMS substrate and to prevent direct exposure of a superconductive metal circuit on the MEMS device to an etching liquid. CONSTITUTION: A cross section wet etching apparatus for protecting a superconducting metal circuit surface comprises an etching protection plate(100) which is deposited with SiN or Si3N4 films on both sides thereof, a MEMS substrate(200) which is attached to one side of the etching protection plate to manufacture a device with a superconductive metal circuit, a first jig(300) which is attached to the other side of the MEMS substrate, and a second jig(400) which is coupled with the first jig by a fastening unit(310).