发明名称 Trench gate semiconductor device and method of manufacturing the same
摘要 A trench gate semiconductor device including: a semiconductor layer having a first conductivity type; a first diffusion region having a second conductivity type having a planar structure on the semiconductor layer; a second diffusion region having the first conductivity type positioned selectively on the first diffusion region; a gate electrode provided via a gate insulation film in each first trench facing the second diffusion region and penetrating through the first diffusion region to reach the semiconductor layer; a first semiconductor region of the second conductivity type provided at a position, in the semiconductor layer, apart in a lateral direction from the first diffusion region; a second semiconductor region of the second conductivity type provided at a position, in the first diffusion region, between the adjacent first trenches; and a main electrode in contact with the semiconductor layer and the second diffusion region.
申请公布号 US8169021(B2) 申请公布日期 2012.05.01
申请号 US20080199224 申请日期 2008.08.27
申请人 HOKOMOTO YOSHITAKA;HARA TAKUMA;KABUSHIKI KAISHA TOSHIBA 发明人 HOKOMOTO YOSHITAKA;HARA TAKUMA
分类号 H01L29/76;H01L21/336;H01L29/94;H01L31/062;H01L31/113;H01L31/119 主分类号 H01L29/76
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