发明名称 Metal-oxide-semiconductor chip and fabrication method thereof
摘要 A metal-oxide-semiconductor chip having a semiconductor substrate, an epitaxial layer, at least a MOS cell, and a metal pattern layer is provided. The epitaxial layer is located on the semiconductor substrate and has an active region, a termination region, and a scribe line preserving region defined on an upper surface thereof. An etched sidewall of the epitaxial layer is located in the scribe line preserving region. The boundary portion of the upper surface of the semiconductor substrate is thus exposed. The MOS cell is located in the active region. The metal pattern layer is located on the epitaxial layer and has a gate pad coupled to the gate of the MOS cell, a source pad coupled to the source of the MOS cell, and a drain pattern, which is partly located on the upper surface of the semiconductor substrate.
申请公布号 US8169019(B2) 申请公布日期 2012.05.01
申请号 US20090556715 申请日期 2009.09.10
申请人 TSEN KUO-CHANG;TU KAO-WAY;NIKO SEMICONDUCTOR CO., LTD. 发明人 TSEN KUO-CHANG;TU KAO-WAY
分类号 H01L29/66 主分类号 H01L29/66
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