发明名称 Light-emitting diode backlight module
摘要 A light-emitting diode backlight module includes a base and a light source disposed on the base. The light source comprises a substrate, a heat sink and an LED chip. The base has a heat conductor. The heat sink of the light source is coupled between the substrate of the light source and the heat conductor of the base. The heat sink has a first part which is adjacent a first side of the substrate and a second part which is adjacent a second side of the substrate. The heat sink is in contact with the heat conductor. The LED chip is disposed on the first part of the heat sink and emits light laterally.
申请公布号 US8168992(B2) 申请公布日期 2012.05.01
申请号 US201113033856 申请日期 2011.02.24
申请人 CHANG CHIA-HSIEN;WU YI-TSUO;LI HSIAO-CHIAO;EVERLIGHT ELECTRONICS CO., LTD. 发明人 CHANG CHIA-HSIEN;WU YI-TSUO;LI HSIAO-CHIAO
分类号 H01L33/60;F21S2/00;F21V8/00;F21V29/00;F21Y101/02;H01L33/48;H01L33/64 主分类号 H01L33/60
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