发明名称 ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL AND CONNECTING STRUCTURE OF CIRCUIT MEMBER
摘要 <p>An adhesive composition comprising: an adhesive component, conductive particles and insulating particles, wherein the ratio of the mean particle size of the insulating particles Ri to the mean particle size of the conductive particles Rc (Ri/Rc) is 120 to 300%.</p>
申请公布号 KR101140088(B1) 申请公布日期 2012.04.30
申请号 KR20087018406 申请日期 2006.12.14
申请人 发明人
分类号 C09J9/02 主分类号 C09J9/02
代理机构 代理人
主权项
地址