发明名称 |
METHODS OF FORMING WIRE BONDS FOR WIRE LOOPS AND CONDUCTIVE BUMPS |
摘要 |
<p>Methods Of Forming Wire Bonds For Wire Loops And Conductive BumpsA method of forming a wire bond using a wire bonding machine is provided. The method includes the steps of: (1) selecting at least one target bonding control value; (2) generating bonding parameters for forming a wire bond using an algorithm and the at least one selected target bonding control value; (3) forming a wire bond using the generated bonding parameters; (4) determining if the at least one selected target bonding control value of the formed wire bond is within a predetermined tolerance of the at least one selected target bonding control value; (5) adjusting at least one bonding adjustment value if the at least one selected target bonding control value of the formed wire bond is not within the predetermined tolerance; and (6) generating revised bonding parameters for forming a subsequent wire bond using an algorithm and the at least one adjusted bonding adjustment value.Fig. 1A</p> |
申请公布号 |
SG179389(A1) |
申请公布日期 |
2012.04.27 |
申请号 |
SG20110070091 |
申请日期 |
2011.09.27 |
申请人 |
KULICKE & SOFFA INDUSTRIES, INC. |
发明人 |
WEI QIN;JON W. BRUNNER;PAUL A. REID |
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