| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting structure which can dissipate heat of a device, i.e. a movable heat source, efficiently without complicating the structure and to provide an image pick-up device to which the mounting structure is applied. <P>SOLUTION: The mounting structure is configured of a stage unit 23, and a base unit 24 arranged to surround the stage unit 23, where the stage unit 23 is mounted to move independently for the base unit 24. The stage unit 23 comprises a device which releases heat during conduction operation, a circuit board 21 mounting a device on one surface, and a heat conductive sheet 25 having a belt-like portion 25a bonded to the other side of the circuit board 21 over a wide range and transmitting heat generated from the device. The base unit 24 has a plate 26 which comes into contact with the belt-like portion 25a and releases heat generated from the device and transmitted through the belt-like portion 25a to the outside of the mounting structure. <P>COPYRIGHT: (C)2012,JPO&INPIT |
