METHOD OF MANUFACTURING TMV PACKAGE-ON-PACKAGE DEVICE

摘要

A method of manufacturing a Through Mold Via (TMV) package-on-package device while preventing a bad solder joint from occurring in the TMV package-on-package device is provided. The method includes coating exposed portions of a lower semiconductor package with an organic soldering preservative, and stacking a top semiconductor package on the lower semiconductor package and connecting lower solder balls of the top semiconductor package with the top solder balls of the lower semiconductor package. According to the method, a bad solder joint may be prevented from occurring when a top semiconductor package is bonded to a lower semiconductor package.