| 摘要 |
<p>The problem addressed is the suppression of cleaning nonuniformity, etching nonuniformity and drying nonuniformity when treating the substrate, such as when etching and cleaning. This invention is a method for producing a semiconductor device having a step for surface-treating a substrate (2) by holding a polygonal substrate (2) in a substrate cassette (1), and immersing the substrate cassette (1) in treatment liquid (30) within a treatment tank (3), wherein the surface treatment of the substrate (2) is performed by holding at least three corner sections of the substrate (2) in ribs (12) provided in the substrate cassette (1).</p> |
