| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sensor device in which stress of a sensor chip is released by a rubber plate and an electric signal of the sensor chip can be taken out without using a bonding wire. <P>SOLUTION: In a sensor device in which a sensor chip 1 is fixed to a case 3 via a rubber plate 2, a metal film 5 is formed on a surface of the rubber plate 2 that is on the sensor chip 1 side, and the sensor chip 1 and the metal film 5 are electrically connected by a bump 13. Thereby, an electric signal from the sensor chip 1 is transmitted to a terminal 4 via the metal film 5 so that, without using a bonding wire, the electric signal of the sensor chip 1 can be taken out. <P>COPYRIGHT: (C)2012,JPO&INPIT |
