VACUUM PROCESSING APPARATUS AND VACUUM PROCESSING METHOD

摘要

PURPOSE: A vacuum processing apparatus and a method thereof are provided to reduce contamination at an inner wall in a transfer chamber since an out gas passes through and is not exposed to a non-processed wafer. CONSTITUTION: A vacuum transfer robot is placed inside a vacuum transfer chamber which connects a process chamber and a cooling chamber. The cooling room includes an exhaust unit, a gas supply unit, a pressure control unit, a support unit, and a loading board. The pressure control unit controls pressure in the cooling chamber. The loading board maintains a wafer(7) supported by the support unit to be adjacent. A temperature control unit controls temperatures on a surface of the loading board to the temperatures for cooling the wafer at high temperatures.